激光切割机，双平台，大幅度提高生产效率，是专为FPC和PCB加工的设备。高效 FPC/PCB外形切割，钻孔及覆盖面开窗，指纹识别芯片加工，TF内存卡分板，手机摄像头模组切割，二维码的打码等应用，分块，分层，指定块或选择区域切割并直接成型，切割边缘整齐圆顺，产品可以以矩形排列多个自动定位切割，采用国际 线品牌的固态紫外线激光机。
Laser cutting machine, dual platform, greatly improve production efficiency, is specially for FPC and PCB processing equipment. High efficiency FPC / PCB shape cutting, drilling and covering surface windowing, fingerprint identification chip processing, TF memory card board division, mobile camera module cutting, two-dimensional code printing and other applications, block, layer, designated block or selected area cutting and direct molding, cutting edge is neat and smooth, products can be arranged in rectangular arrangement, multiple automatic positioning cutting, using solid-state ultraviolet excitation of international first-line brand Optical and mechanical.
高精度，低漂移的振镜与快速的无铁芯直接电机系统平台组合，在快速切割同时保持微米量 的高精度，无需人工操作，操作简单，实现同类型 键式模式，大大提高生产效率。废气处理系统；吸风系统可以将切割废气全部消除，避免了对操作人员的危害和对环境的污染。自动化程度高；振镜自动校正，自动调焦，全程实现自动化，采用激光位移传感器自动调整焦点到台面的高度，实现快速对接。功能强大的操作系统，简单方便。
High precision, low drift galvanometer combined with rapid coreless direct motor system platform can keep micron level high precision in fast cutting, without manual operation, easy to operate, realize the same type of one key mode, and greatly improve the production efficiency. Exhaust gas treatment system; suction system can eliminate all cutting waste gas, avoiding the harm to operators and environmental pollution. High degree of automation; galvanometer automatic correction, automatic focus, the whole process of automation, using laser displacement sensor to automatically adjust the height of focus to the table, to achieve rapid docking. Powerful operating system, simple and convenient。
机器规格 Machine specifications
| NO | 项目 Item | 技术参数 technical parameter |
| 1 | 型号 Model | YSV-6A |
| 2 | 主机尺寸 Host size | 1550mm*1550mm*1700mm |
| 3 | 激光机重量 Laser weight | 2000KG |
| 4 | 激光机供电电源 Laser power supply | AC220V/3.5KW |
| 5 | 激光源 Laser source | 紫外激光器UV Laser |
| 6 | 激光器 Laser | 美国光波 American Lightwave |
| 7 | 材料厚度 Material thickness | ≤1.2mm（视材料而定） |
| 8 | 扫描速度 Scanning speed | 1-900mm/ms |
| 9 | 整机精度 Overall accuracy | ±20μm |
| 10 | 平台定位精度 Platform positioning accuracy | ±2μm |
| 11 | 平台重复精度 Platform repeat accuracy | ±2μm |
| 12 | 切割幅度 Cutting range | 350mm*350mm/350mm(双平台) |
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